Electronic component assembly

ABSTRACT

An electronic component assembly including an electrical connector and an electronic subassembly. The electrical connector has a housing with a receiving area, electrical contacts connected to the housing, and fusible elements. The electrical contacts include first electrical connection sections in the receiving area and second electrical connection sections proximate a first exterior side of the housing. The fusible elements are connected to the second electrical connection sections. The electronic subassembly includes a printed wiring assembly and electronic components connected to opposite sides of the printed wiring assembly. The printed wiring assembly includes a relatively rigid section with the electronic components connected thereto and a flex cable forming deflectable lateral side sections with contact areas contacting the first electrical connector sections of the electrical contacts.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to interconnection of electroniccomponents and, more particularly, to an interconnection within anelectronic package, which uses a flex cable, and electricalinterconnection between components and assembly substrates.

2. Brief Description of Prior Developments

Flex cables, such as flat flexible cables (FFC) and flexible printedcircuits (FPC) are generally well know. Currently the most typicalinterconnection method between electronics packages and motherboards isball grid array (BGA) or land grid array (LGA) type of solderableinterconnection. In large modules (containing a lot of functionalitiesand components) usage of this interconnection method set demands formotherboard technology selection (e.g. wiring of the module requiresmicro via technology in motherboard).

Referring to FIG. 1, there is shown a side view of an electroniccomponent assembly 10 known in the prior art. The assembly 10 generallycomprises a substrate 12, a plurality of electronic components 14, 15,and fusible elements 16. The electronic components 14, 15 areelectrically connected to the fusible elements 16 by conductive paths(not shown) on and/or through the substrate 12. The fusible elements 16can provide a soldered ball grid array (BGA) or land grid array (LGA)interconnection. These types of array interconnections are currently avery typical interconnection method for connecting complicatedelectronics packages in applications, such as a microprocessor toanother component (for example). One problem which exists with BGA orLGA interconnections is that components cannot be assembled on thebottom side of the module; the side which comprises the fusible elements16. Thus, the electronic components 14, 15 can be mounted on only thetop side 18 of the substrate 12.

Another typical or conventional method of interconnection comprises aboard edge plating process. Board edge plating processes are used inexisting printed wiring board technology. Electrical contactinterconnection areas are formed on lateral side edges of a rigidprinted circuit board by a plating process. This type of manufacturingprocess is difficult and does not always provide an accurate process.

Due to limitations of single sided component assembly on the module, thetotal area (physical size of the module) is larger than it could be if adouble-sided component assembly were used on a physical module. This issolved by improving component assembly processes with the presentinvention. An example of these are shrinkage of component-to-componentspacing rules and usage of smaller component packages in assembly lines.This adds unnecessary complexity to the module electronics manufacturingprocesses.

SUMMARY OF THE INVENTION

In accordance with one aspect of the present invention, an electroniccomponent assembly is provided including an electrical connector and anelectronic subassembly. The electrical connector has a housing with areceiving area, electrical contacts connected to the housing, andfusible elements. The electrical contacts include first electricalconnection sections in the receiving area and second electricalconnection sections proximate a first exterior side of the housing. Thefusible elements are connected to the second electrical connectionsections. The electronic subassembly includes a printed wiring assemblyand electronic components connected to opposite sides of the printedwiring assembly. The printed wiring assembly includes a relatively rigidsection with the electronic components connected thereto and a flexcable forming deflectable lateral side sections with contact areascontacting the first electrical connector sections of the electricalcontacts.

In accordance with another aspect of the invention, an electroniccomponent assembly is provided comprising a flex cable and a pluralityof electronic components connected to the flex cable. The flex cablecomprises a general folded shape with the electronic components arrangedin a general stacked orientation. Portions of the flex cable at bentsections of the folded shape form lateral side contact areas forcontacting electrical connection areas of another member.

In accordance with one method of the present invention, a method ofassembling an electronic component assembly is provided comprisingconnecting an electrical connector to a first electronic componentcomprising fusing fusible elements of the electrical connector to thefirst electronic component; and inserting an electronic subassembly intothe electrical connector, wherein the electronic subassembly comprisesprinted wiring assembly with a flex cable and second electroniccomponents connected to the printed wiring assembly, wherein the flexcable forms lateral side sections with bent contact areas contactingcontacts inside the electrical connector.

In accordance with another aspect of the present invention, a method ofassembling an electronic component assembly is provided comprisingconnecting a plurality of electronic components to a flex cable; andfolding the flex cable to arrange the electronic components in a generalstacked orientation, wherein an exterior portion of the flex cable at abend of the flex cable between the electronic components forms a contactarea for electrically connecting the flex cable to another electroniccomponent.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and other features of the present invention areexplained in the following description, taken in connection with theaccompanying drawings, wherein:

FIG. 1 is a side view of a conventional electronic component assembly;

FIG. 2 is a sectional view of an electronic component assemblyincorporating features of the present invention;

FIG. 3 is a side view of an electronic subassembly used in the assemblyshown in FIG. 2;

FIG. 4 is a side view of a printed wiring assembly used in thesubassembly shown in FIG. 3;

FIG. 5 is a sectional view of the electrical connector shown in FIG. 2;

FIG. 6 is a sectional view of the electrical component assembly shown inFIG. 2 attached to another member;

FIG. 7 is a top view of one embodiment of the electrical connector shownin FIGS. 2, 5 and 6;

FIG. 8 is a sectional view of an alternate embodiment of the presentinvention;

FIG. 9 is a top plan view of the electronic subassembly shown in FIG. 8;

FIGS. 10-16 are top plan views showing steps used to form an alternateembodiment of the electronic subassembly shown in FIG. 9; and

FIG. 17 is a diagram showing use of an assembly of the present inventionin one embodiment of a portable hand-held electronic device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 2, there is shown a schematic sectional view of anelectronic component assembly 20 incorporating features of the presentinvention. Although the present invention will be described withreference to the exemplary embodiments shown in the drawings, it shouldbe understood that the present invention can be embodied in manyalternate forms of embodiments. In addition, any suitable size, shape ortype of elements or materials could be used.

The electronic component assembly 20 generally comprises an electricalconnector 22 and an electronic subassembly 24. Referring also to FIGS. 3and 4, the electronic subassembly 24 generally comprises a printedwiring assembly 26 and electronic components 28, 29, such as integratedcircuits. In alternate embodiments, more than two electronic componentscould be provided on the printed wiring assembly 26. The printed wiringassembly 26 comprises a flex cable 30 and a relatively rigid section 32.In the embodiment shown, the relatively rigid section 32 is located ontop and bottom sides of the flex cable 30. The flex cable 30 has lateralside sections 34 which extend outward past the sides of the rigidsection 32. The flex cable 30 comprises electrical conductors on aflexible electrically insulating substrate. The conductors of the flexcable 30 are electrically connected to conductors on the rigid section32, or are located at holes through the rigid section 32 which areadapted to receive conductors of the electronic components 28, 29. Thus,the conductors of the flex cable 30 are electrically connected to thecontacts of the electronic components 28, 29 at the rigid section 32.The electrical conductors of the flex cable 30 extend along the lateralside sections 34 and are preferably exposed along at least the bottomsides 36 of the lateral side sections 34.

The rigid section 32 could be comprised of any suitable type of printedwiring member, such as two thin printed circuit boards, for example. Therigid section 32 preferably sandwiches the middle section of the flexcable 30 therein. When the printed wiring assembly 26 is formed, therigid section 32 and flex cable 30 are preferably formed into a unitaryone piece structure. As used herein, this combined flexible substrateand rigid or semi-rigid substrate configuration is referred to as a“flex-rigid printed wiring board” technology. The printed wiringassembly 26 functions as an interposer between the electronic components28, 29 and the electrical connector 22. The electronic components 28, 29are stationarily attached to the printed wiring assembly 26 at the topand bottom sides of the rigid section 32. The electronic components 28,29 are preferably attached to the printed wiring assembly 26 after theprinted wiring assembly is formed. However, in an alternate embodiment,the electronic components 28, 29 could be attached to the rigidsection(s) 32 prior to connection of the rigid section with the flexcable 30.

Referring also to FIG. 5, the electrical connector 22 generallycomprises a housing 38, electrical contacts 40 and fusible elements 42.The housing 38 comprises a receiving area 44. The receiving area extendsinto the housing from a second side of the housing opposite the firstside 50. The electrical contacts 40 are mounted to the housing 38. Theelectrical contacts 40 comprise first electrical connection sections 46which extend into the receiving area 44. More specifically, the firstelectrical connection sections 46 extend into the receiving area 44 fromlateral sides of the receiving area. The first electrical connectionsections 46 can comprise deflectable spring sections. Alternatively, thefirst electrical connection sections 46 could comprise stationarycontact areas. The electrical contacts 40 also comprises secondelectrical connection sections 48 proximate a first exterior side 50 ofthe housing 38. The fusible elements 42 are mounted on the secondelectrical connection sections 48. FIG. 7 shows a top view of oneembodiment of the electrical connector 22 having a square shapedreceiving area 44 and four arrays of the electrical contacts 40 locatedon the four sides of the receiving area. The embodiment shown in FIG. 7is merely one example of how the receiving area could be shaped and theelectrical contacts arranged relative to that shape. In alternateembodiments, the receiving area could comprise any suitable type ofshape including round or polygonal.

As seen in FIG. 2, the electronic subassembly 24 is adapted to beinserted into the receiving area 44 of the electrical connector 22. Thelength and/or width of the electronic subassembly 24 is larger than thelength and/or width of the receiving area 44. As the subassembly 24 isinserted into the receiving area 44 the lateral side sections 34 arebent or deform. This causes the electrical conductors on the bottomsides 36 of the lateral side sections 34 to come into contact with thefirst electrical connection sections 46 of the electrical contacts 40.This electrical connection provides an electrical connection between theelectronic components 28, 29 of the subassembly 24 with the fusibleelements 42.

As seen in FIG. 6, the fusible elements 42 are melted when theelectrical connector 22 is electrically connected to another member 52,such as a printed circuit board, for example. In a preferred method ofthe present invention, the electrical connector 22 is connected to themember 52 before the electronic subassembly 24 is connected to theelectrical connector. Thus, the subassembly 24 can be connected to themember 52 after the fusible elements 42 have been melted. This reducesthe exposure of the subassembly 24 to the heat required to melt thefusible elements 42. After the subassembly 24 is connected to theelectrical connector 22 a suitable device or system could be used toprevent the subassembly 24 from subsequently unintentionally movingrelative to the electrical connector. For example, a potting material oradhesive could the inserted into the receiving area 44. As anotherexample, a cover could be located on top of the subassembly 24 andstationarily attached to the connector 22 to prevent the subassembly 24from moving. Suitable guides, registrations, or fixation means could beused to prevent misalignment of the conductors on the flex cable 30 withthe electrical connectors 40. The lateral side sections 34 of the flexcable 30 preferably comprise suitable rigidity, in view of the limitedspace for bending, to resiliently bend and exert a suitable biasingforce against the contacts 40 to retain the conductors of the flexcircuit against the contacts 40, and provide a frictional force to atleast partially retain the subassembly inside the retaining area 44.

Referring now to FIG. 8, an alternate embodiment of the presentinvention is shown. The electronic component assembly 52 generallycomprises an electrical connector 54 and an electronic subassembly 56.The electrical connector 54 generally comprises a housing 58, electricalcontacts 60 and fusible elements 42. The housing 58 comprises areceiving area 62. The electrical contacts 60 are mounted to the housing58. The electrical contacts 60 comprise four levels 64, 65, 66, 67 offirst electrical connection sections 68 which extend into the receivingarea 62. More specifically, the first electrical connection sections 68extend into the receiving area 62 from lateral sides of the receivingarea. The first electrical connection sections 68 can comprisedeflectable spring sections. Alternatively, the first electricalconnection sections 68 could comprise stationary contact areas. Theelectrical contacts 60 also comprises second electrical connectionsections proximate a first exterior side 70 of the housing 58. Thefusible elements 42 are mounted on the second electrical connectionsections. In an alternate embodiment, the electrical connector 54 mightnot comprise fusible elements 42. Instead, second ends of the electricalcontacts 60 could comprise solder tales such as through-hole soldertales or surface mount solder tales.

The subassembly 56 comprises multiple electronic components or devices72, 73, 74, 75 and a flex cable 76. In alternate embodiments, more orless than four components could be used. The components 72-75 areelectrically and mechanically attached to the flex cable 76 atconnections 78. Any suitable type of connection could be used for theconnections 78. The electronic components 72-75 could comprise anysuitable type of electronic component such as an integrated circuit forexample. The flex cable 76 has a general folded shape with theelectronic components 72-75 arranged in a general stacked orientation.The flex cable 76 comprises electrical conductors which form portions ofthe flex cable at the bent sections of the folded shape to form lateralside contact areas 80 which contact the electrical connection areas ofthe electrical contacts 60. The bent lateral side sections of the flexcable 76 comprise suitable rigidity, in view of the limited space forbending, to resiliently bend and exert a suitable biasing force againstthe contacts 60 to retain the conductors of the flex circuit against thecontacts 60, and provide a frictional force to at least partially retainthe subassembly inside the receiving area 62. The top sides of theelectronic components 72-75 (i.e., the sides of the electroniccomponents located opposite their respective connections 78) can beplaced against a side of the flex circuit 76 in this sandwichedconfiguration.

Referring now also to FIGS. 10-16, one method of forming an alternateembodiment of the subassembly will be described. FIG. 16 shows a topplan view of the subassembly 82. In this embodiment, the subassembly 82comprises a single flex cable 84 and a plurality of electroniccomponents 86-91. The flex cable 84 has been folded to arrange theelectronic components 86-91 in a general stacked figuration. FIGS. 10-15show, respectively, the steps used to fold the flex cable 84 to form thesubassembly 82.

FIG. 10 shows the flex cable 84 before the flex cable 84 is folded.Electronic components 86-91 are arranged in two orthogonal rows andmounted to a same side of the flex cable 84. In an alternate embodiment,the electronic components could be mounted to more than the same side.In addition, more than two rows could be provided. The flex cable 84comprises a general L shape with two orthogonal leg sections 92, 94. Inalternate embodiments, a “T” shape, or single row “|” shape, or a “+”shape could be provided. These are only some examples. Any suitableshapes prior to folding of the flex circuit could be provided.

Comparing FIG. 10 to FIG. 11, the first leg section 92 is folded over acenter section 96 as indicated by arrow 98. This locates the firstelectronic component 86 over the center section 96 as seen in FIG. 11.Referring also to FIG. 12, the second leg section 94 is then folded overthe center section 96 as indicated by arrow 100. This locates the secondelectronic component 87 over the center section 96. Referring also toFIG. 13, the first leg section 92 is then folded over the center section96 as indicated by arrow 102. This locates the third electroniccomponent 88 over the center section 96. Referring also to FIG. 14, thesecond leg section 94 is then folded over the center section 96 asindicated by arrow 104. This locates the fourth electronic component 89over the center section 96. Referring also to FIG. 15, the first legsection 92 is then folded over the center section 96 as indicated byarrow 106. This locates the fifth electronic component 90 over thecenter section 96. Referring finally also to FIG. 16, the second legsection 94 is then folded over the center section 96 as indicated byarrow 108. This locates the sixth electronic component 91 over thecenter section 96.

With this type of arrangement, the flex cable 84 forms connectionsections 110 at the four sides of the subassembly 82 at the bends of theflex cable 84. The connection sections 110 are located at differentheights or levels of the subassembly and can be subsequently connectedto contacts of an electrical connector or equivalent connection system.The folding order can allow substantially simultaneous interconnectionof contact surfaces located on the package edge.

The present invention can provide easier rework of the assembly aftersale. In service (in the other words after the initial sale), servicepersonnel can just pull out the damaged component from the socket andreplace it with a new one without using any soldering. This provides afast, simple and straightforward service or rework process. Thisinvention can improve protection against physical damages of theelectronic components by locating the electronic components inside thehousing of the electrical connector as well as at least partiallysurrounded by the flex circuit. If solder ball connections are used withthe electrical connector to another electronic device, such as a motherprinted circuit board, the electronic components do not need to besoldered which enables avoiding heat treatments for the electroniccomponents during their production. The subassembly can be pushed into areceiving socket electrical connector in a relatively simple and fastassembly.

Principles of physical modularity are getting more popular in the fieldof electronics. Usage of conventional interconnection methods betweencomponent packages/physical modules and motherboards set limitations foreffective usage of module area. One limitation is that components can beadded only on one side of the physical module substrate. To solve thatlimitation, the interconnections of the present invention are providedon physical module's edge area. This enables double sided componentassembly on the module. This provides a possibility to shrink the sizeof the module.

Electronics miniaturization requires multiple integrated circuitsassembled into one component package. For BGA interconnections, anincreased number of input/output signals force manufacturers toimplement and introduce higher BGA pin densities for component packages.This adds special demands for application motherboard technologies andthereby adds cost into all electronics applications. To solve thatlimitation, the interconnections of the present invention are at leastpartially provided on component packages edge area(s). This enablessmaller physical dimensions for component packages without cost penaltyfor motherboard technologies.

The present invention provides an interconnection method in-betweenphysical modules and electronics enabling double sided componentassembly of the physical modules. The present invention providesinterconnections of the module on the edges of the device. The presentinvention enables double sided component assembly in the module. Theinterconnections can be produced with flex or flex-rigid PWB technology.There is no need for complicated board-edge plating technologiescommonly used in PWB manufacturing. For the socket on the motherboard,intelligent board-to-board connector can be provided because thesolution does not waste module surface area.

The present invention enables a smaller total size for physical modulesand more functionalities to existing area. The present invention canprovide smaller size for physical modules due to double-sided componentassembly for the module. The present invention can provide thepossibility to simplify motherboard technology. With the presentinvention, there is easier rework of application in after sales. Themodule is possible to be disassembled from socket without any soldering.The present invention improves protection against physical damages anddust in the case of a socket which can be closed. The Module electronicscan be sealed inside of the socket. There is also the possibility toimprove Electro Static Discharge (ESD) and Electro Magnetic Charge (EMC)protection with shielding construction added into socket.

The present invention can enable higher Integrated Circuit (IC) countfor components packages within a same physical dimensions (morefunctionalities to existing area). The present invention can avoid thecomponent going through high temperature soldering process. The presentinvention can use a Lead Free soldering process which is about to belegislated in Europe in the near future. Soldering process heat profilecan be higher than conventional ones. More demanding heat treatment forelectronics during assembly can be provided.

The present invention can provide an interconnection method in-betweencomponent packages containing multiple integrated circuits and anassembled application. The present invention can provideinterconnections of the component on the edges of the device. Thepresent invention can provide interconnections between integratedcircuits which can be done within the component package by using ahigh-density flex interposer. This enables less I/O's for a componentitself. This then leads to low-density need in motherboard technology.The present invention can provide interconnections between a componentand a socket produced with flex PWB technology. Interconnections betweena socket and a motherboard can be done by using conventional gull-wingleads (such as Thin Quad Flat Package (TQFP) packages are using). Usageof a flex cable enables bendable package philosophy and the possibilityto locate interconnection surfaces in multiple levels on package edgeswithout extra cost. Customized socket on the motherboard can be providedfor an intelligent component-to-board connector.

Referring also to FIG. 17, one example of a hand-held mobilecommunications device or mobile station 210 is shown which can include acomponent assembly of the present invention. In alternate embodiments,the component assembly could be used in any suitable device. The mobilestation 210 typically includes a housing 212, a user interface (UI) 220,and electronic circuitry 222 connected to the user interface and locatedinside the housing. The electronic circuitry can comprise a microcontrol unit (MCU) having an output coupled to an input of a display 214and an input coupled to an output of a keyboard or keypad 216 of theuser interface. The electronic circuitry comprises the assembly of thepresent invention, such as 20 or 52.

The mobile station 210 may be considered to be a hand-held radiotelephone, such as a cellular or mobile telephone, or a personalcommunicator, or a PDA, or a gaming device, and may have a microphoneand a speaker for conducting voice communications. The mobile station210 could also be contained within a card or module that is connectedduring use to another device. For example, the mobile station 210 couldbe contained within a PCMCIA or similar type of card or module that isinstalled during use with a portable data processor, such as a laptop ornotebook computer, or even a computer that is wearable by the user.

The MCU is assumed to include or be coupled to some type of memory,including a read only memory (ROM) for storing an operating program, aswell as a random access memory (RAM) for temporarily storing requiredata, scratchpad data memory, received data packets and data packetsprepared for transmission, etc. A separate removable SIM (not shown) canbe provided as well. The SIM could store, for example, a preferredpublic land mobile network (PLMN) list and other subscriber relatedinformation.

The mobile station 210 also contains a wireless section that includes adigital signal processor (DSP), or equivalent high-speed processor, aswell as a wireless radio frequency (RF) transceiver 218 comprising atransmitter and a receiver. The transceiver is coupled to an antenna 234for communication with a network operator via a base station 236. In analternate embodiment, features of the present invention could be usedwith any suitable type of wireless communications device or mobilephone.

As seen in FIG. 17, the keypad 216 includes an alphanumeric key section216 a and a control key section 216 b. The control key section of 216 bincludes two soft keys 224, 225 and an up/down scroll key 226. However,in alternate embodiments, the control key section could be comprised ofany suitable number or type of keys or cursor control device. The twosoft keys 224, 225 are located beneath two control indicator sections227, 228 of the display 214. When one of the soft keys 224, 225 aredepressed, the controller can perform the menu function listed in thecontrol indicator section 227, 228 located above the depressed soft key.

It should be understood that the foregoing description is onlyillustrative of the invention. Various alternatives and modificationscan be devised by those skilled in the art without departing from theinvention. Accordingly, the present invention is intended to embrace allsuch alternatives, modifications and variances which fall within thescope of the appended claims.

1. An electronic component assembly comprising: an electrical connectorhaving a housing with a receiving area, electrical contacts connected tothe housing, and fusible elements, wherein the electrical contactscomprise first electrical connection sections in the receiving area andsecond electrical connection sections proximate a first exterior side ofthe housing, and wherein the fusible elements are connected to thesecond electrical connection sections; and an electronic subassemblyconnected to the electrical connector, the electronic subassemblycomprising a printed wiring assembly and electronic components connectedto opposite sides of the printed wiring assembly, wherein the printedwiring assembly comprises a relatively rigid section with the electroniccomponents connected thereto and a flex cable forming deflectablelateral side sections with contact areas contacting the first electricalconnector sections of the electrical contacts.
 2. An electroniccomponent assembly as in claim 1 wherein the electronic componentscomprise a integrated circuit chip.
 3. An electronic component assemblyas in claim 1 wherein the first electrical connection sections of thecontacts comprise deflectable spring contact sections.
 4. An electroniccomponent assembly as in claim 1 wherein the receiving area extends intoa second side of the housing opposite the first side of the housing. 5.An electronic component assembly as in claim 1 wherein the firstelectrical connection sections of the contacts extend into the receivingarea from lateral sides of the receiving area.
 6. An electroniccomponent assembly as in claim 1 wherein the deflectable lateral sidesections of the flex cable are resiliently reflected by the electricalconnector when the electronic subassembly is inserted into the receivingarea, and wherein the flex cable exerts a biasing force against thefirst electrical connection sections.
 7. A hand-held mobile electronicdevice comprising: a housing; a user interface (UI) section on thehousing; and electronic circuitry inside the housing and coupled to theuser interface, wherein the electronic circuitry comprises an electroniccomponent assembly comprising: an electrical connector having a housingwith a receiving area, electrical contacts connected to the housing, andfusible elements, wherein the electrical contacts comprise firstelectrical connection sections in the receiving area and secondelectrical connection sections proximate a first exterior side of thehousing, and wherein the fusible elements are connected to the secondelectrical connection sections; and an electronic subassembly connectedto the electrical connector, the electronic subassembly comprising aprinted wiring assembly and electronic components connected to theprinted wiring assembly, wherein the printed wiring assembly comprisesat least one relatively rigid section with the electronic componentsconnected thereto and at least one flex cable forming at least onedeflectable lateral side section with contact areas contacting the firstelectrical connector sections of the electrical contacts.
 8. Anelectronic component assembly comprising: a flex cable; and a pluralityof electronic components connected to the flex cable, wherein the flexcable comprises a general folded shape with the electronic componentsarranged in a general stacked orientation and wherein portions of theflex cable at bent sections of the folded shape form lateral sidecontact areas for contacting electrical connection areas of anothermember.
 9. An electronic component assembly as in claim 8 wherein theflex cable comprises at least two orthogonal sections.
 10. An electroniccomponent assembly as in claim 9 wherein the two orthogonal sections arefolded over a center section at least once.
 11. An electronic componentassembly as in claim 10 wherein at least one of the orthogonal sectionsis folded over the center section at least twice.
 12. An electroniccomponent assembly as in claim 8 wherein the electronic components areattached to a same side of the flex cable.
 13. An electronic componentassembly as in claim 8 wherein the electronic component assemblycomprises a general square shape and the lateral side contact areas arelocated on at least two sides of the general square shape.
 14. Anelectronic component assembly as in claim 13 wherein the lateral sidecontact areas are located on four sides of the general square shape. 15.An electronic component assembly as in claim 8 wherein the electroniccomponents comprise at least two rows of electronic componentsalternatingly folded over a center section.
 16. An electronic componentassembly as in claim 8 wherein the electronic components are attached toopposite sides of the flex cable.
 17. An electronic component assemblyas in claim 8 further comprising an electrical connector socket, whereinthe plurality of electronic components are located at least partially inthe socket and the flex cable electrically connects the socket with theplurality of electronic components.
 18. An electronic component assemblyas in claim 17 wherein the flex cable is electrically connected tocontacts of the socket inside an electronic component receiving area ofthe socket.
 19. A method of assembling an electronic component assemblycomprising: connecting an electrical connector to a first electroniccomponent comprising fusing fusible elements of the electrical connectorto the first electronic component; and inserting an electronicsubassembly into the electrical connector, wherein the electronicsubassembly comprises printed wiring assembly with a flex cable andsecond electronic components connected to the printed wiring assembly,wherein the flex cable forms lateral side sections with bent contactareas contacting contacts inside the electrical connector.
 20. A methodof assembling an electronic component assembly comprising: connecting aplurality of electronic components to a flex cable; and folding the flexcable to arrange the electronic components in a general stackedorientation, wherein an exterior portion of the flex cable at a bend ofthe flex cable between the electronic components forms a contact areafor electrically connecting the flex cable to another electroniccomponent.
 21. A hand-held mobile communications device comprising: ahousing; a user interface (UI) section on the housing; electroniccircuitry inside the housing and coupled to the user interface, whereinthe electronic circuitry comprises a transceiver and an electroniccomponent assembly comprising: a flex cable; and a plurality ofelectronic components connected to the flex cable, wherein the flexcable comprises a general folded shape with the electronic componentsarranged in a general stacked orientation and wherein portions of theflex cable at bent sections of the folded shape form lateral sidecontact areas for contacting electrical connection areas of anothermember of the electronic circuitry.